先进的智能IP摄像机Soc 海思 Hi3519AV100资料可咨询

先进的智能IP摄像机Soc 海思 Hi3519AV100资料需要的，可咨询

roman, HelveticaNeue-Light, Helvetica Neue, arial, Hiragino Sans GB, 冬青黑体, MICrosoft YaHei New, Microsoft Yahei, 微软雅黑, 宋体, SIMSun, STXihei, 华文细黑, sans-serif">海思 hi3519AV100主要特点：双核[email]2xA53@1.4GHz4K[/email] @ 60fps H.265编解码器2chn / 4chn StitchingvDSP @ 630MHz和NNIE引擎PCI-e 2.0 + USB2.0高速存储























Hi3519A V100 4K Smart IP camera SoC
Breif Data Sheet


Issue&nBSP;       02
Date        2018-06-20



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HiSilicon Technologies Co., Ltd.
Address:                New R&D Center, Wuhe Road, Bantian, Longgang District, Shenzhen 518129 P. R. China





Introduction
Hi3519A V100 is a high-performance and low-power 4K Smart IP Camera SoC designed for IP cameras, action cameras, panoramic cameras, rear view mirrors, and UAVs. Hi3519A V100 introduces H.265/H.264 encoding and decoding, with performance up to 4K x 2K@60 fps and 1080p@240 fps.
Integrating with the HiSilicon fourth-generation ISP, Hi3519A V100 provides WDR, multi-level NR, 6DoF DIS, and multiple image enhancement and correction algorithms, ensuring professional image quality. Hi3519A V100 also supports 4K raw data output, facilitating post editing. With the advanced low-power process and architecture design, Hi3519A V100 provides users with long-lasting Battery life.
Hi3519A V100 integrates a powerful programmable neural network inference engine and a vector DSP, backing the application of multiple intelligent algorithms.
Hi3519A V100 supports multi-sensor inputs and introduces a built-in high-performance AVS engine to implement 4K 2-pipe to 4-pipe real-time panoramic video stitching.
With the hardware-based 6DoF DIS, Hi3519A V100 has reduced its dependence on the mechanical head during 4K@60 fps video recording.
Hi3519A V100 features efficient and ample computing resources to assist customers in developing industry and consumer applications. Backed by the dual-core A53 processor and the DSP, Hi3519A V100 offers the dual-system solution, enabling fast startup, real-time performance, and connections with rich peripheral drives.
Hi3519A V100 uses the advanced 12 nm low-power process and miniaturization package and supports DDR4/LPDDR4 SDRAMs, allowing the product miniaturization design.
With the stable and easy-to-use mobile SDK design provided by HiSilicon, Hi3519A V100 can assist customers in rapid product mass production.
Key Features
• Low Power

−
1.9 W power consumption in a typical scenario for 4K x
2K (3840 x 2160)@30 fps H.265 encoding+neural network
algorithm
• −SVP
− A neural network inference engine (NNIE), a high-
− performance DSP, and multiple CV acceleration
− engines that facilitate customers' algorithm development
for achieving product differentiation
Multiple neural network options
2.0 TOPS computing performance Complete APIs and toolchains Multiple applications such as face
detection/recognition and target detection/tracking
• 4K@60 fps Encoding
4K x 2K (3840 x 2160)@60 fps or 1080p@240 fps H.265/H.264 encoding
• Multi-Sensor Inputs
Up to 5-channel sensor inputs, supporting applications such as panoramic camera and UAVs
• Hardware-based Multi-Channel Video Stitching 2-channel 3K x 3K (3000 x 3000)@30 fps or 4-channel 1080p@30 fps stitching and recording
• High-Speed Interface
PCIe, USB 3.0, and SDIO 3.0 interfaces that facilitate customers' extension of external functional modules





Key SpecificationsProcessor Core
• Dual-core arm [email]Cortex-A53@1.4GHz[/email], 32 KB I-cache, 32 KB D-cache or 256 KB L2-cache
• Neon acceleration and integrated FPU
DSP
• Integrated Tensilica Vision P6 DSP@630 MHz
• 32 KB I-cache, 32 KB I-RAM, and 512 KB D-RAM
• 0.3 TOPS neural network computing performance
• Huawei LiteOS
NNIE
• Multiple neural network options, such as AlexNet, VGG, ResNet, and GoogleNet
• Multiple neural network options for target detection, such as the Faster R-CNN, SSD, and YOLOv2
• 2.0 TOPS neural network computing performance
• Complete APIs and tool chains (compilers and simulators) to adapt to customized networks
Video Encoding and Decoding
• H.265 main profile, level 5.1
• H.264 baseline/main/high profile, level 5.1
• I-/P-/B-slice supported for H.264/H.265 encoding and
d−ecoding
• B−aseline JPEG
• M− aximum resolution for H.264/H.265 encoding and
decoding: 8192 x 8192
• H.265/H.264 encoding and decoding performance: 3840 x 2160@60 fps+720p@30 fps encoding 3840 x 2160@60 fps decoding
3840 x 2160@30 fps encoding+3840 x 2160@30 fps decoding
• Maximum resolution for JPEG encoding and decoding: 8192 x 8192
• Maximum JPEG encoding and decoding performance: 16 MP (4608 x 3456)@30 fps
• Multiple bit rate control modes, such as CBR, VBR, AVBR, FixQp, and QpMap
• Up to a bit rate of 120 Mbit/s for H.265 encoding outputs and 200 Mbit/s for H.264 encoding outputs
• Encoding of up to eight ROIs
VI Interface
• 12-lane image sensor serial inputs, as well as mipi, sub- LVDS, Hispi, and SLVS-EC interfaces
• Up to 5-channel sensor serial inputs and multiple combination modes: 12-lane, 8-lane+4-lane, or 4-lane+4 x 2-lane
• Maximum input resolution: 7680 x 4320
• 10-/12-/14-bit Bayer RGB DC timing VI
• BT.656 and BT.1120 VI
1–channel to 4-channel YUV inputs through the MIPI virtual channels
ISP and Image Processing
• Multi-channel TDM to process multi-sensor video inputs
• Adjustable 3A functions (AE, AWB, and AF)
• FPN removal
• 2-frame WDR exposure, local tone mapping, strong light suppression, and backlight compensation
• Defect pixel correction and lens shADIng correction
• Multi-level 3DNR, which removes motion smearing and chroma noise and provides excellent image effects in low illumination
• 3D-LUT color adjustment
• Image dynamic contrast enhancement and EDGE enhancement
• CAC and purple fringe removal
• Dehaze
• 6DoF DIS and rolling shutter correction
• LGDC and fisheye correction
• Image rotation by 90° or 270°
• Image mirroring and flipping
• Multi-channel 1/15.5x–16x scaling outputs
• OSD overlaying of up to eight regions before encoding
• ISP adjustment tool on the PC
2D Graphics Processing
• BitBlt operation
• Line drawing
• Alpha blending
• Color key
• CSC
−
Hardware Accelerated Engine for Video
Stitc−hing
• 2-channel and 4-channel AVS
• Stitching performance:
2-channel 3000 x 3000@30 fps VI and 3840 x 2160@30 fps VO
4-channel 1080 x 1920@30 fps VI and 3840 x 2160@30 fps VO
VO Interface
• HDMI 2.0, supporting up to 4K x 2K (4096 x 2160)@60
f−ps outputs
• 4-lane MIPI DSI, supporting up to 1080p@60 fps outputs
• 6−-/8-/16-/24-bit digital LCD/BT.656/BT.1120 interface,
s−upporting up to 1080p@60 fps RGB/YUV outputs
• Two independent HD VO channels (DHD 0 and DHD 1):
Any two interfaces can be used for the display of different sources.
DHD 0 supports 36-picture split display. DHD 1 supports 16-picture split display.
• One PIP layer, which can be overlaid with DHD 0 or DHD 1
• Two full-screen GUI graphics layers in ARGB1555 or ARGB8888 format for DHD 0 and DHD 1
• One hardware cursor layer in ARGB1555 or ARGB8888 format (configurable), supporting a maximum resolution







of 256 x 256
• One scaling WBC channel
CV Hardware Accelerated Engine
• Hardware acceleration for binocular depth map computing, supporting the processing performance up to 720p@30 fps
• Hardware acceleration for IVE 2.1 intelligent operators for feature point detection, optical flow, and computer morphology processing, and so on
audio Interface
• Integrated audio codec, supporting 16-bit audio inputs and outputs
• Dual-channel differential MIC inputs for reducing the background noise
• I2S interface for 8-channel audio TDM inputs and dual- channel audio outputs (mutually exclusive with the built- in audio codec)
• HDMI audio output
Audio Encoding and Decoding
• Voice encoding and decoding complying with multiple protocols by software
• Audio encoding in formats such as G.711, G.726, and
file:///C:\Users\admin\AppData\Local\Temp\ksohtml8796\wps4.png−
AAC
−
VQE
−
Netw−  ork Interface
• One GE interface:
RGMII and RMII modes
10/100 Mbit/s half-duplex or full-duplex 1000 Mbit/s full-duplex
TSO for reducing the CPU usage
Security Engine
• AES, DES, and 3DES algorithms implemented by using hardware
• RSA1024/2048/3072/4096 signature verification algorithm implemented by using hardware
• HASH-SHA1/224/256/384/512 and
HMAC_SHA1/224/256/384/512 tamper proofing algorithms implemented by using hardware
• file:///C:\Users\admin\AppData\Local\Temp\ksohtml8796\wps5.pngIntegrated 32-kbit OTP storage space and hardware random number generator
• file:///C:\Users\admin\AppData\Local\Temp\ksohtml8796\wps6.pngSecure boot
• memory and I/O security ISOlation
Peri−pheral Interface
• −Two SDIO 3.0 interfaces:
− SDIO 0 supports the SDXC card.
SDIO 1 supports the Wi-Fi module.
• One USB 3.0/PCIe 2.0 multiplexing port USB 3.0 only or PCIe 2.0 X1+USB 2.0.
RC and endpoint supported as the PCIe 2.0 interface Configurable USB host/device mode as the USB 3.0 interface
• One USB 2.0 port, supporting configurable host/device mode
• Internal POR signal output and external reset input
• Independent battery for the built-in RTC
• Integrated 4-channel LSADC
• Nine UART interfaces (Some pins are multiplexed with other pins.)
• Multiple I2C, SPI, and GPIO interfaces
• file:///C:\Users\admin\AppData\Local\Temp\ksohtml8796\wps7.pngOne IR interface
• Eight PWM interfaces (Some pins are multiplexed with other pins.)

−
External Memory Interface
• 3−2-bit DDR4/LPDDR4 SDRAM interface
− Maximum frequency of 1333 MHz for the
− DDR4/LPDDR4 SDRAM
Maximum DDR address space of 3.5 GB
• S−I NOR flash interface
− 1-/2-/4-line mode
− 3-/4-byte address mode
− Maximum capacity of 256 MB
• SPI NAND flash interface
− SLC flash
− 2 KB/4 KB page size
− 8-/24-bit ECC (unit: KB)
− Maximum capacity of 1 GB
• N− AND flash interface
8-bit data width
− SLC flash
− 2 KB/4 KB page size
8-/16-/24-bit ECC (unit: KB)
Maximum capacity of 1 GB
• EMMC 5.1 interface HS400
Maximum capacity of 2 TB
Configurable Boot Modes
• Booting from the BOOTROM
• Booting from the SPI NOR flash
• Booting from the SPI NAND flash
• Booting from the NAND flash
• Booting from an eMMC
Multiple Image Burning Modes
• Image burning through UART 0
• Image burning through an SD card
• Image burning through a USB device
SDK
• file:///C:\Users\admin\AppData\Local\Temp\ksohtml8796\wps8.pnglinux SMP
• Linux+Huawei LiteOS dual-system solution
• High-performance H.265 IOS/android decoding library
Phys−ical Specifications
• Power consumption
1.9 W power consumption in a typical scenario for 4K x 2K (3840 x 2160)@30 fps encoding+neural network algorithm
Multi-level power saving mode
• Operating voltages